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| TriNano CMM: nanometer uncertainty for a micro price. |
| Written by Ernst Treffers |
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Current micro CMMs comply with the Abbe principle in 2D or even in 3D, which is a preferred method to reach 3D nanometer uncertainty. Most of these CMMs are the result of academic research, in which the challenge is to achieve the lowest uncertainty over a large measurement range. This resulted in technologically advanced, but expensive systems. Within the micro manufacturing industry a large measurement range often is not the most important factor. Most objects (or their molds) have dimensions of a few centimeters (lenses, watch base plates, small gears, etc.) and fit in a match box. To fasten market adaptation of micro coordinate metrology, a fast and cost effective micro CMM has been developed: TriNano.
Figure 1: Schematic 3D representation of TriNano’s moving work piece table.
Figure 2: Schematic 2D operating principle, with the work piece table in its neutral position (left) and after making a translation in local y’-direction (right). On each linear stage, the scale of an optical linear encoder is mounted. At the point of intersection of the measurement axes of these encoders the probe tip is located. As the orientation of the encoder scale does not vary with respect to the probe, as can be seen in figure 2, the TriNano complies with the Abbe principle over its entire measurement range. As a result, rotations of the work piece table will have little effect on the measured dimension. Cost effective design In addition, TriNano employs linear encoders to determine the position of the workpiece table. Compared to conventional ultra precision CMMs, which often employ laser interferometer systems; this principle results in a considerable cost reduction. Several other means have been implemented to reduce costs without compromising on quality or ease of use.
Figure 3. TriNano employs a moving workpiece table (testing purposes is shown) supported by VPL air bearings in order to comply with the Abbe principle in 3D. The parallel configuration of the three identical stages supporting the superior dynamic behavior of TriNano. This mass of each stage with short and stiff structural loops. On machine measurements show that the natural frequency of the complete system is 75 Hz. This allows a high control bandwidth required for ultra precision scanning measurements of unknown micro parts with high velocity. Kinematic design An important benefit of an exactly constrained design is that it will isolate critical parts or systems from the influence of manufacturing tolerances or deformations of the support frame, due to temperature variations or loading of the frame. An over constrained design often suffers from backlash and requires tight tolerances in order to function properly. In order to obtain the highest measurement repeatability, exactly constrained designing is necessary [3]. The design of the TriNano is therefore based on well known kinematic design principles, in order to obtain an exactly constrained design.
Figure 4. Exactly constrained design: classical (left), TriNano (right) A classical solution of exactly constraining a body is to use six slender rods, as displayed on the left of figure 4. A single (VPL) air bearing as used in the TriNano, constrains 3 d.o.f.; 2 rotations and 1 translation. Applying an elastic line hinge releases one of the rotational constraints. Combining three of these air bearing-elastic line hinge combinations as shown on the right of figure 4 results in an exactly constrained work piece table which allows repeatable positioning of the work piece table. Thermal design
Figure 5. Schematic of the thermal design of the TriNano The volume in which the parts of the metrology loop are located is enclosed by a thermal isulation shield as shown in figure 6. A temperature control system can be employed to create a stable environment inside this volume. Parts to be measured can be placed inside the machine prior to the actual measurements, in order to reach the desired temperature upfront and minimize throughput times. The thermal sensitivity of the TriNano is further reduced by designing the parts of the metrology loop to have a large thermal time constant. For most parts this is achieved by adjusting their dimensions, instead of using expensive low thermal expansion materials. Only parts which need to be of a specific slender shape (e.g. measurement scale, elastic line hinge) are made from a low expansion material.
Figure 6: TriNano N100 CMM with housing (left, schematic) and without (right). Gannen probing systems
The suspension of these Gannen probes consists of a silicon membrane with three slender rods as shown in figure 8.
Figure 8: Chip and stylus of the Gannen XM probe with example products. The probe tip is connected to the centre platform of this chip via a stylus. When the probe tip is displaced, the three slender rods will deform. This deformation is measured using piezo resistive strain gauges on the slender rods. The strain gauges are manufactured together with their electrical connections and the slender rods in a series of etching and deposition steps. This results in a design with an extremely low moving mass of 25 mg including the weight of stylus and tip, as shown in figure 8. Also, it allows the use of rods with a thickness down to several micrometers, which as a result are very compliant. The stylus of the Gannen XP has a length of typically 6.8 mm. In this configuration an isotropic stiffness of 480 N/m is obtained and the sensitivity of the probe is similarin each probing direction. Since the piezo resistive strain gauges are deposited onto the silicon membrane, hysteresis is below 0.05% and the standard deviation in repeatability is 2 nm over its whole measurement range and in any probing direction [6]. This combination of a highly compliant design with low moving mass and nanometer repeatability allows the use of micrometer sized probe tips. Currently tungsten probe tips with a diameter down to 42 μm have been manufactured and used with this probe, allowing 3D measurements on micrometer sized features. Conclusion More information
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